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Edwards introduces green, cost-efficient vacuum pumps 2016-03-17
The iXM and IXL900R series are ideal for semiconductor etch and chemical vapour deposition (CVD) applications, and plasma vapour deposition (PVD) applications, respectively ?
NXP announces new low-voltage translators 2016-02-24
The semiconductor manufacturer supports the migration of applications to lower voltages with its AXP family of logic translators, resulting to power savings for battery-powered applications ?
Top 10 innovative products of 2015 2015-12-22
Many companies have introduced products in preparation for the growing IoT. There are also innovations in computing devices, where chips have not only become smaller but more powerful as well. ?
DMOS FET transistor arrays pack 1.5A sink-output driver 2015-12-18
The TBD62064A series and TBD62308A series from Toshiba are equipped with four channels of 50V/1.5A rated output, suitable for driving constant voltage unipolar stepping motors. ?
9 memory products that shift car apps into high gear 2015-10-30
The smarter, connected cars will be evermore hungry for memory to support a wide range of applications, including those that require near-instant boot up. So here's a checklist of recent memory product introductions suitable for automotive use. ?
Toshiba uncloaks high-power white LEDs 2015-09-01
The company said the 4A5B type devices achieve a high luminous flux of 140lm (min) compared to the 130lm (min) of conventional general products of the TL1L4 series. ?
Compact BLE sol'ns support -40C to 105C operation range 2015-08-27
Cypress' PSoC 4 BLE Programmable SoC and PRoC BLE Programmable Radio-on-Chip solutions target industrial, automotive and lighting applications that must operate in extreme climates. ?
256Mb HyperFlash supports 333MB/s bandwidth 2015-08-11
The device from Cypress is geared for high-performance applications, such as automotive instrument clusters, industrial automation, communication systems and medical equipment. ?
Miniature single-chip module targets IoT apps 2015-06-29
The i.MX 6Dual SCM from Freescale enables hundreds of components such as processors, memory, power management and RF parts to be integrated in a single platform for the Internet of Things. ?
Fairchild takes on MEMS space with 6-axis IMU 2015-06-22
The FIS1100 includes tri-axis accelerometer and tri-axis gyroscope, AttitudeEngine DSP and XKF3 sensor fusion software. ?
USB Power Delivery controllers get USB-IF certification 2015-06-04
The EZ-PD CCG1 (CYPD1103) and EZ-PD CCG2 (CYPD2103) controllers from Cypress Semiconductor have received Product Test IDs 1095059 and 1095054, respectively ?
Verification IP for DDR4 3DS allows higher-density DRAMs 2015-05-15
Synopsys' VIP for DDR4 3DS is natively integrated with its Verdi protocol analyser, offering a graphical protocol-aware debug environment that synchronises memory transactions with signals. ?
Configurable test systems reduce testing cost 2015-04-27
The STS series from NI is a line of configurable test systems geared to lower the costs of semiconductor production test and lab characterisation ?
Test module enables process optimisation 2015-04-24
The Exensio-Test from PDF Solutions allows IC companies to streamline operations and claims to offer significantly reduced test times through the implementation of real-time adaptive test algorithms. ?
SSL inspection sol'n for network monitoring, security apps 2015-04-22
The Transparent SSL Proxy solution from EZchip claims to deliver 20Gb/s of SSL Proxy throughput and more than 30,000 new connection set-ups per second on a single TILE-Gx processor. ?
Dialog unveils Bluetooth Smart 'wearable-on-chip' 2015-04-08
The DA14680 wearable-on-chip Bluetooth Smart features the 30uA/MHz ARM Cortex-M0 processor, 8Mbit flash memory, audio support, temperature sensor and competitive battery life. ?
Tower develops IR sensor for Intel's 3D camera 2015-03-06
The near infrared light sensor is used for depth sensing by Intel within its RealSense, which has a 3.5?m pixel size and flaunts a global shutter. ?
ON Semi uncovers low-light enabled fast auto focus tech 2015-03-02
The second generation Phase Detect Auto Focus (PDAF) technology boasts a unique pixel micro-lens technology that allows fast focus at 25 Lux light levels. ?
Hua Hong develops 0.2?m RF SOI process design kit 2015-02-27
Hua Hong's 0.2m RF SOI PDK solution is developed from Cadence's IC5141 EDA software, and integrates RF modelling and simulation platform such as PSP SOI and BSIM SOI. ?
Spreadtrum chipset integrates Tizen OS 2015-02-16
The Tizen operating system is now integrated with the Samsung Z1, Spreadtrum confirms in a news release. The Z1 runs the Tizen 2.3 OS and integrates Spreadtrum's SC7727S mobile chipset platform. ?
Ultra-low-power FRAM targets industrial automation apps 2014-12-29
The MB85RDP16LX from Fujitsu features multiple optimisations that promise to reduce energy consumption to less than 10 per cent of what is required by standard FRAM solutions. ?
Cypress BLE sol'ns achieve Bluetooth 4.1 qualification 2014-12-11
The Bluetooth Low Energy solutions integrate a Bluetooth Smart radio, a 32bit ARM Cortex-M0 core with ultra-low-power modes, programmable analogue blocks and CapSense capacitive touch-sensing. ?
eASIC completes JESD204B interoperability at 10Gb/s 2014-12-10
Analog Devices' AD9234 12bit, 1GSPS high-speed dual ADC can interoperate with the eASIC Nextreme-3 28nm that eases the design and integration of high bandwidth multi-channel radios. ?
Image sensor tech promises a wealth of features 2014-11-26
GalaxyCore developed the Through-Silicon-Illumination technology that claims to boost sensitivity and signal-noise ratio with reduced thermal noise, dark current and crosstalk, and higher frame rates. ?
Ingenic unveils MIPS-based wearable, IoT solution 2014-11-14
The Newton2 allows wearable device manufacturers to design and promote to market a differentiated product in a shorter period of time ?
ST delivers dust-free, water-resistant pressure sensor 2014-11-13
At 0.76mm thin, the new pressure sensor is the only one in a fully moulded package, enabling higher-accuracy measurements. ?
Cypress joins ranks of vendors selling MCUs with BLE 2014-11-12
A latecomer to the IoT market, Cypress launched its PSoC 4 BLE and PRoC BLE chips positioned to take advantage of the expected upgrade of millions of remote controls from infrared to Bluetooth ?
ST begins novel prod'n process for MEMS sensors 2014-11-07
The company started production of MEMS sensors using its proprietary THELMA60 (60um thick epi-poly layer for micro-gyroscopes and accelerometers) surface-micromachining fabrication process. ?
Kilopass ports OTP NVM tech to TSMC's 16nm FinFET process 2014-10-31
The OTP 2T bit cell technology can scale easily from 180-28nm and beyond across a variety of process technologies including low power, high-voltage and high-K metal gate. ?
IDT unveils first RF switch with high isolation, linearity 2014-10-22
The F2912 has a combination of low insertion loss, high isolation and linearity making, it an ideal choice for base stations, microwave backhaul and front haul, test equipment, and wireless systems. ?


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