V2x: 802.11p trumps LTE and 5G
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2016-05-09 |
Direct Short Range Communication, which is based on IEEE 802.11p, has been the subject of extensive standardisation, product development and field trials, proving its benefit for V2x. |
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Exploring Samsung's 14 nm LPE FinFET
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2016-02-03 |
Samsung has been gearing up for the launch of its 14 nm Low Power Plus (LPP) process used in the Exynos 8 SoC. In this article, we look into the changes we should expect. |
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Preventing common MEMS failure mechanisms
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2016-02-01 |
The first step in ensuring MEMS reliability is to avoid common pitfalls during the design and process development phase to assure a stronger and more reliable part-upon-marketplace introduction. |
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Examining metal eFuses
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2015-11-16 |
Here is a look at two electrically blown fuse structures (eFuse) used in metal gate logic processes. The first eFuse structure that we look at is made by Intel and the second by TSMC. |
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Exploring the power of Zigbee 3.0
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2015-08-13 |
In this article, we take inventory of where things really stand, and make some assessment of where things are going in the Internt of Things market. |
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iPhone 6 Plus teardown: Lots of hardware in small space
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2014-09-22 |
The new iPhone 6 Plus has a host of new technologies packed in a relatively bigger package, including Apple's A8 SoC with 64bit architecture, an easily removable battery and a fingerprint cable that no longer rips off when the case is opened. |
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Teardown: Samsung crams a bevy of sensors in Galaxy S5
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2014-04-08 |
Teardown.com dissected the Galaxy S5 and found out that Samsung's latest Android device is chock full of sensors, all crammed into its tiny chassis. It also includes a bigger battery and a slightly bigger screen. |
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Examining the sparse matrix problem
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2014-01-08 |
The semiconductor ecosystem itself is transitioning towards an increasingly complex yet transparent Internet, making it harder for upstart companies to get into the microprocessor business. |
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Teardown: iPad Air's A7 faster at 1.4GHz
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2013-11-05 |
Early teardowns of the iPad Air from Chipworks and iFixit point to a relatively faster A7 processor and a host of components similar to those found in previous generations. |
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Apple sticks to usual design, pricing for iPhone 5c
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2013-10-02 |
With the iPhone 5c, Apple continues pricing and hardware design that is almost identical to the original iPhone 5, an IHS teardown reveals. |
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Teardown: Galaxy Note 3 still king of phablets
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2013-10-01 |
TechInsights deems the Galaxy Note 3 as still the leading phablet in the market based on chips utilised in the device. |
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Teardown: A7, fingerprint sensor main draws for iPhone 5s
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2013-09-24 |
A teardown of the iPhone 5s confirms that along with the fingerprint sensor, the A7 is a major enticement for consumers to pick this unit over the 5c. |
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Addressing memory scaling concerns
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2013-07-08 |
Here are some promising research and design directions to overcome challenges posed by memory scaling. |
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New Broadcom, Samsung ICs debut via Galaxy S4
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2013-04-30 |
Samsung's new eight-core processor, the Exynos Octa 5410, along with Broadcom's wireless and NFC chips make their first appearance in the latest Galaxy S. |
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The iPhone 5 inside out
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2012-09-27 |
Apple's iPhone 5 A1428 model, torn apart for a closer inspection |
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Image gallery: Tearing down Samsung Galaxy S3
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2012-06-25 |
In this teardown, UBM TechInsights probed the inner workings of the European version of Samsung Galaxy S3 smartphone. |
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Image gallery: The latest iPad revealed
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2012-03-29 |
Here's a teardown analysis of the third generation iPad, including detailed findings on the differences between the A5X processor and the standard A5. |
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Address hardware/software integration issues with combined prototyping solutions
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2012-01-11 |
Find out how to reap the individual advantages of prototypes in combination with other prototyping techniques. |
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Unraveling Sony Vita
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2012-01-03 |
In the significant sockets of Sony's Playstation Vita, you can find IBM, Toshiba, Qualcomm and Avago. |
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Incorporating M2M into smartphones
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2011-12-01 |
Read about leveraging the latest smartphone technology into a commodity M2M engine. |
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Peek inside iPhone 4S
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2011-10-25 |
Here's an image gallery of what can be found inside the iPhone 4s. |
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Adoption of Bluetooth, Wi-Fi in handsets to rise rapidly
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2011-08-15 |
Here's a look at the lineups of Qualcomm and its acquisition Atheros to assess their impact on a handset market that's embracing Bluetooth and Wi-Fi. |
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Yukyung marshals army of IC vendors for Viliv tablet
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2011-03-28 |
"Globally" designed and based on Windows, Yukyung Technologies' Viliv X70 EX 3G is a good example of a tablet that preceded the iPad. |
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Hurdling the stumbling blocks of femtocell design
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2008-11-03 |
Much has been made of the technical challenges to developing and deploying networks of femtocells. This article looks at the key practical challenges that have been overcome to make this possible. |
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Deal with OFDM, a new old technology
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2007-07-16 |
OFDM has its roots in the military communication systems. Today, building an OFDM-based system has many considerations, depending on the operating environment and application requirements. This article briefly tackles OFDM's history, and discusses the challenges of developing systems with OFDM and OFDM design tips. |
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GPS technology empowers 3G wireless handsets
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2004-07-16 |
Qualcomm uses a GPS-based solution to improve positioning availability and accuracy in the wireless sector. |
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Self-synchronizing a CDMA cellular network
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1999-09-09 |
This paper describes the concept of utilizing the normal messaging of mobile stations operating in an IS-95 CDMA network to transfer time between various BTSs (Base Station Transceivers). IS-95 is a time-synchronous system in that all BTSs operate from a common time reference, which is specified to be the same as the time scale used by the Global Positioning System (GPS). This design choice provides the CDMA network with several advantages over an asynchronous design, but does require some means to distribute time throughout the network. |
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