| The endless pursuit of smaller packages
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2016-03-15 |
| In this article, we explore the creativity in semiconductor package integration, while anticipating the release of the Samsung's Galaxy S7 and the iPhone 7. |
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| Peek inside the first high bandwidth memory
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2015-08-14 |
| In this teardown article, we reveal the innards of SK Hynix's high bandwidth memory, in AMD's Radeon 390X Fury X graphics card. |
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| Tearing down Hynix's high bandwidth memory
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2015-07-22 |
| In this article, we explore the composition of Hynix's high bandwidth memory (HBM), which addresses bandwidth limitations with DDR4 type SDRAM and DDR5. |
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| Examining 3D embedded substrate power packaging
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2015-07-03 |
| Here is a look at 3D embedded substrate power packaging technologies, which will be increasingly deployed in everything from cell phones to hybrid electric vehicles. |
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| IoT drives chip packaging innovation
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2015-03-09 |
| The need for high performance multi-functional devices in a single package is pushing the industry to innovate in multi-chip packaging. This high level of integration has presented huge challenge. |
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| Advances in power supply packaging
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2014-10-29 |
| Here's a look at where the power industry is going in terms of component integration and thermal management. It also covers the developments in DC/DC power converter density. |
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| Address SoC routing congestion with 2.5D SiP
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2014-06-05 |
| The best of both worlds approach that the electronics industry has come up with to solve a design dilemma is the System in Package (SiP) in a 2D package. |
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| Tips for cost-effective 3D IC production
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2014-02-19 |
| Know how to distribute the cost-of-ownership across the supply chain. |
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| Latest developments in 3D IC technologies
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2013-12-13 |
| Here's a look at the various forms of 3D IC technology, starting with the simpler incarnations and culminating in today's start-of-the-art implementations. |
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| Teardown: Galaxy Note 3 still king of phablets
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2013-10-01 |
| TechInsights deems the Galaxy Note 3 as still the leading phablet in the market based on chips utilised in the device. |
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| Importance of migrating to DDR4
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2013-03-26 |
| Learn about the significance of the DDR4 SDRAM device in the context of system level trends. |
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| Improve SoC yields with diagnostic and repair tools for embedded memory
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2012-08-09 |
| Learn about embedded memory test solutions, including fault detection in very deep submicron technologies, repair at the manufacturing level, as well as diagnosis for process improvement and field repair capabilities. |
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| Addressing integration concerns with SiP technologies
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2012-04-17 |
| Learn about the benefits and drawbacks of system-in-package technologies. |
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| Wide I/O driving 3-D with TSV
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2012-03-09 |
| Find out how wide I/O is leading the way to through-silicon vias-based heterogeneous die stacks. |
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| Advances in 3D-IC testing
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2012-02-03 |
| Read about the design-for-3D-test architecture and implementation flow developed by researchers at Industrial Technology Research Institute based on the Synopsys test solution. |
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| Designing 3D-ICs (Part 2)
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2011-12-08 |
| Here's the second instalment of this series that tackles the tools that can be used to handle a complete backend flow, and enable true 3D design partitioning, synthesis, placement, and routing. |
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| Designing 3D-ICs (Part 1)
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2011-12-07 |
| Learn about the tools that can be used to handle a complete backend flow, and enable true 3D design partitioning, synthesis, placement, and routing. |
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| Recent developments in 3D integration
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2011-10-19 |
| Here's a discussion on through-silicon via and mechanically flexible interconnect, and how these are being currently developed. |
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| A primer on 3D-IC design challenges
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2011-09-27 |
| Know the 3D-IC design challenges such as system exploration, floorplanning, analysis, and design for test (DFT), and learn how designs will evolve as 3D-IC goes on to become a necessity for managing power, performance, form factor, and cost goals. |
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