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STMicroelectronics, Dot Wireless to collaborate on solutions for 3G mobile phones 1999-10-15
STMicroelectronics and Dot Wireless Inc. have announced an alliance to co-develop integrated CDMA baseband chips and related technology for third-generation (3G) mobile phones. ?
Use high-voltage drivers for large flat-panel displays 2006-11-16
Designers are finding the optimum trade-off between strengths and limitations of available manufacturing technologies including HV-CMOS, BCD and silicon-on-insulator SOI to make high-voltage drivers in large flat displays. ?
Smartphone basics: Connectivity and sensors 2014-07-25
In smart devices nowadays, accelerometers and compasses have a quantitative edge over gyroscopes, but we are seeing more frequently the combination of accelerometer and gyroscope in one package. ?
NoC: Evolution toward the MPSoC era 2006-03-16
Learn more about a low-cost on-chip interconnect that works to enable multiprocessor SoCs. ?
New tech key to future-proof camera systems 2006-09-01
The whole mobile imaging value chain is expected to benefit from new interface standards, achieving lower costs, faster time-to-market and future-proof solutions. ?
Making RF cellular design simple 2005-11-01
The challenge in RF handsets is to consume less PCB space as more features are embedded without sacrificing performance ?
Improve ESD protection in cellphones 2005-10-03
Dual clamping claims to bring better electrostatic discharge immunity compared to current single ESD-protection diodes ?
Door zone applications open up for LIN 2007-02-16
Door zone modules have become very recognizable solutions in the area of automotive comfort electronics. ?
Developing macrocell libraries in CMOS 2005-09-16
The Crolles2 Alliance brings resources together to develop macrocell libraries in 90nm and 65nm CMOS technologies ?
Breaking into the consumer arena 2008-02-18
The availability of inexpensive, ultracompact and power-efficient MEMS sensors has revolutionized the way in which people interact with mobile terminals, game console and remote controller allowing the implementation of advanced functions and compelling user interfaces. ?
VIPower makes easier PFC converters 2003-11-03
STMicroelectronics' VK05 smart power IC sports low complexity and low cost and is a suitable solution for a low cost, active PFC in lighting applications. ?
Co-design method enables speech recognition SoC 2002-09-16
Two STMicroelectronics design engineers use a system-level design flow based on the CoWare N2C method to create a speech-recognition capable SoC. ?
Wide I/O driving 3-D with TSV 2012-03-09
Find out how wide I/O is leading the way to through-silicon vias-based heterogeneous die stacks. ?
Utilize interrupt features of a MEMS accelerometer 2011-12-26
Find out how to implement reliable and robust interrupt-based applications using MEMS-based accelerometers. ?
Unraveling Sony Vita 2012-01-03
In the significant sockets of Sony's Playstation Vita, you can find IBM, Toshiba, Qualcomm and Avago. ?
Triac triggering: Positive, negative supply basics 2014-11-26
This article tackles the basics of positive and negative supplies in relation to triac triggering compliance. It will explore the impact of supply topology on output polarity. ?
ToF measurements pave the way for user-interaction 2013-05-30
Discover how time-of-flight measurements open up user-interaction scenarios. ?
Tips for accurate estimation of battery life 2014-10-24
Developers still struggle to ensure they have enough battery to operate their products for the anticipated duration. There are, however, seven tips that can help guarantee accurate estimation of battery life. ?
The iPhone 5 inside out 2012-09-27
Apple's iPhone 5 A1428 model, torn apart for a closer inspection ?
The future of mixed-signal design 2000-02-01
I hear two contradictory things regarding mixed-signal IC design. One set of voices says the systems-on-chip (SoC) of the future will be large mixed-signal systems, and the proportion of these being built will double from about 33 percent currently to 66 percent by 2005. The other set of voices says everything will be big digital chips constructed in ever-deeper submicron CMOS, in that the ASICs of the future will use as many 15 million logic gates, but that the analog and mixed-signal circuitry will be left off-chip. ?
Test power ICs to withstand radiation 2015-12-21
Failure in space is to be avoided at all costs because there is no human around to make repairs. Testing can help assure that the ICs will withstand radiation. ?
Teardown: Samsung crams a bevy of sensors in Galaxy S5 2014-04-08
Teardown.com dissected the Galaxy S5 and found out that Samsung's latest Android device is chock full of sensors, all crammed into its tiny chassis. It also includes a bigger battery and a slightly bigger screen. ?
Taking new stabs at programmable analog 2000-03-01
Programmable logic has some traditional advantages over ASIC design. The gate count of FPGAs approaches that of custom circuits. FPGAs can be programmed?and re-programmed?out in the field, enabling fast time to market. ASICs, in comparison, need careful attention to layout and fabrication technology. It can take anywhere from six weeks to two years (depending on the complexity of the circuit) to get an ASIC working properly. ?
SystemC revision drives toward synchronized system-level design 2001-04-01
Synopsys and CoWare launches the SystemC to create a standardized dialect of C/C++ for both hardware and software design. SystemC provides a C/C++ class library that represents hardware concepts such as concurrency for designers to utilize. ?
Switch fabrics pave way to scalable networking 2000-12-01
Topics span from Infiniband design hurdles to in-box benefits of RapidIO, along with various on-chip switch schemes like SuperHyway for highly integrated system chips. ?
SuperHyway provides SoC backbone 2000-12-01
A step ahead of CompactPCI, Compact Packet Switching Backplane (cPSB) is emerging as a viable solution for interconnect problems. ?
Smartphone basics: NFC, humidity sensors 2014-08-15
Here's an exploration of the near field communications hardware, as well as the barometric and humidity sensors that can be found in today's smart devices. ?
Shifting to requirements-driven verification, test 2014-11-11
Here is an evaluation of the pros, cons and potential obstacles to requirements-driven verification and test so you may decide if it is the next step in evolution. ?
Picking out FETs for hot-swap source connection 2013-11-19
Know what needs to be considered when selecting FETs for hot-swap source connection. ?
Peek inside iPhone 4S 2011-10-25
Here's an image gallery of what can be found inside the iPhone 4s. ?


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